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W29GL032C
7.6
Common Flash Memory Interface (CFI) Mode ............................................................. 25
7.6.1
Query Instruction and Common Flash memory Interface (CFI) Mode ............................. 25
8
ELECTRICAL CHARACTERISTICS ......................................................................................... 29
8.1
8.2
8.3
8.4
Absolute Maximum Stress Ratings ............................................................................... 29
Operating Temperature and Voltage ............................................................................ 29
DC Characteristics ........................................................................................................ 30
Switching Test Circuits.................................................................................................. 31
8.4.1
Switching Test Waveform ............................................................................................... 31
8.5
AC Characteristics ........................................................................................................ 32
8.5.1
8.5.2
8.5.3
8.5.4
8.5.5
8.5.6
8.5.7
Instruction Write Operation ............................................................................................. 33
Read / Reset Operation .................................................................................................. 34
Erase/Program Operation ............................................................................................... 36
Write Operation Status .................................................................................................... 46
WORD/BYTE CONFIGURATION (#BYTE)..................................................................... 50
DEEP POWER DOWN MODE........................................................................................ 52
WRITE BUFFER PROGRAM.......................................................................................... 52
8.6
Recommended Operating Conditions........................................................................... 53
8.6.1
At Device Power-up ........................................................................................................ 53
8.7
8.8
8.9
8.10
Erase and Programming Performance ......................................................................... 54
Data Retention .............................................................................................................. 54
Latch-up Characteristics ............................................................................................... 54
Pin Capacitance ............................................................................................................ 54
9
PACKAGE DIMENSIONS ......................................................................................................... 55
9.1
9.2
9.3
9.4
TSOP 48-pin 12x20mm ................................................................................................ 55
TSOP 56-pin 14x20mm ................................................................................................ 56
Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBGA64) ......................... 57
Thin & Fine-Pitch Ball Grid Array, 6x8 mm 2 , pitch: 0.8 mm, ? =0.4mm (TFBGA48) .... 58
10
ORDERING INFORMATION..................................................................................................... 59
10.1
10.2
Ordering Part Number Definitions................................................................................. 59
Valid Part Numbers and Top Side Marking .................................................................. 60
11
HISTORY .................................................................................................................................. 61
ii
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